Integrated circuit product and chip floorplan arrangement thereof

ABSTRACT

An integrated circuit product includes a first chip to a twelfth chip. The first to fourth chips are respectively arranged in a first quadrant, a fourth quadrant, a third quadrant, and a second quadrant of the integrated circuit product, and the first chip is adjacent to the second chip and the fourth chip. The fifth to eighth chips are respectively arranged in the first quadrant, the fourth quadrant, the third quadrant, and the second quadrant of the integrated circuit product, and any two of the fifth to eighth chips are not adjacent to each other. The ninth to twelfth chips are respectively arranged in the first quadrant, the fourth quadrant, the third quadrant, and the second quadrant of the integrated circuit product, and any two of the ninth to twelfth chips are not adjacent to each other.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of co-pending U.S. patent applicationSer. No. 17/572,250, filed on Jan. 10, 2022, which claims the benefit ofpriority to Patent Application No. 202110967790.0, filed in China onAug. 23, 2021, and also claims the benefit of priority to U.S.Provisional Application Ser. No. 63/166,703, filed on Mar. 26, 2021; theentirety of which is incorporated herein by reference for all purposes.

BACKGROUND

The present invention generally relates to the packaging of integratedcircuits (ICs), and, more particularly, to the floorplan arrangement ofthe chips and/or chiplets (hereinafter collectively referred to aschips) of IC packaging.

Nowadays advanced packaging is common in the IC industry. However, thepoor floorplan arrangement may result in the following drawbacks: wastedarea (which renders the finished product uncompetitive due to the largesize), poor heat dissipation (which degrades the chip performance),difficulty in output and/or input wiring (which increases the difficultyof packaging), and/or non-ideal relative positions of the chips (whichcauses waste of chip pins). Therefore, a floorplan arrangement of thechips is needed to solve at least one of the above-mentioned problems.

SUMMARY

An example embodiment of an integrated circuit (IC) product isdisclosed, comprising: a first chip, a second chip, a third chip, afourth chip, a fifth chip, a sixth chip, a seventh chip, an eighth chip,a ninth chip, a tenth chip, an eleventh chip, and a twelfth chip. Thefirst chip, the second chip, the third chip, and the fourth chip arerespectively arranged in a first quadrant, a fourth quadrant, a thirdquadrant, and a second quadrant of the IC product, and the first chip isadjacent to the second chip and the fourth chip. The fifth chip, thesixth chip, the seventh chip, and the eighth chip are respectivelyarranged in the first quadrant, the fourth quadrant, the third quadrant,and the second quadrant of the IC product, and any two of the fifthchip, the sixth chip, the seventh chip, and the eighth chip are notadjacent to each other. The ninth chip, the tenth chip, the eleventhchip, and the twelfth chip are respectively arranged in the firstquadrant, the fourth quadrant, the third quadrant, and the secondquadrant of the IC product, and any two of the ninth chip, the tenthchip, the eleventh chip, and the twelfth chip are not adjacent to eachother.

Another example embodiment of an integrated circuit (IC) product isdisclosed, comprising: a first chip, a second chip, a third chip, afourth chip, a fifth chip, a sixth chip, a seventh chip, an eighth chip,a ninth chip, a tenth chip, an eleventh chip, and a twelfth chip. Thefirst chip, the second chip, the third chip, the fourth chip, the fifthchip, the sixth chip, the seventh chip, the eighth chip, the ninth chip,the tenth chip, the eleventh chip, and the twelfth chip aresubstantially on a plane. If the first chip is rotated 90 degrees on theplane with respect to a center of the IC product, the first chip willsubstantially overlap with the second chip or the fourth chip, and ifthe first chip is rotated 180 degrees on the plane with respect to thecenter, the first chip will substantially overlap with the third chip.If the fifth chip is rotated 90 degrees on the plane with respect to thecenter, the fifth chip will substantially overlap with the sixth chip orthe eighth chip, and if the fifth chip is rotated 180 degrees on theplane with respect to the center, the fifth chip will substantiallyoverlap with the seventh chip. If the ninth chip is rotated 90 degreeson the plane with respect to the center, the ninth chip willsubstantially overlap with the tenth chip or the twelfth chip, and ifthe ninth chip is rotated 180 degrees on the plane with respect to thecenter, the ninth chip will substantially overlap with the eleventhchip.

Both the foregoing general description and the following detaileddescription are examples and explanatory only, and are not restrictiveof the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to an embodiment of the presentinvention.

FIG. 2 illustrates a simplified side view of an IC product according toan embodiment of the present invention.

FIG. 3 illustrates a simplified side view of an IC product according toanother embodiment of the present invention.

FIG. 4 illustrates the center point and the distribution of thequadrants of the IC product according to the present invention.

FIG. 5 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 6 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 7 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 8 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 9 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 10 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 11 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 12 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 13 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 14 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

FIG. 15 illustrates a schematic diagram of a simplified chip floorplanarrangement of an IC product according to another embodiment of thepresent invention.

DETAILED DESCRIPTION

Reference is made in detail to embodiments of the invention, which areillustrated in the accompanying drawings. The same reference numbers maybe used throughout the drawings to refer to the same or like parts,components, or operations.

FIG. 1 is a schematic diagram of a simplified chip floorplan arrangementof an IC product according to an embodiment of the present invention.The IC product 100 includes a first logic chip 112, a second logic chip114, a third logic chip 116, a fourth logic chip 118, a first memorychip 122, a second memory chip 124, a third memory chip 126, a fourthmemory chip 128, a first other chip 132, a second other chip 134, athird other chip 136, and a fourth other chip 138. FIG. 1 shows a topview of an IC product 100, and FIGS. 2 and 3 each show a simplified sideview of an IC product (along the A-A′ cross-section in FIG. 1 )according to an embodiment of the present invention. In the embodimentof FIG. 2 , the IC product 100 includes a substrate 150, and the logicchips, the memory chips, and the other chips shown in FIG. 1 arearranged at the same plane PL on the substrate 150. There are multiplemicro bumps 152 between the substrate 150 and the logic chips, memorychips, and other chips, and there are multiple bumps 154 under thesubstrate 150. In the embodiment of FIG. 3 , the IC product 100 includesan interposer 140, and the logic chips, the memory chips, and the otherchips shown in FIG. 1 are arranged on the interposer 140. There aremultiple micro bumps 152 between the interposer 140 and the substrate150, and there are multiple bumps 154 under the substrate 150. The firstlogic chip 112, the second logic chip 114, the third logic chip 116, andthe fourth logic chip 118 may be logic circuits with computingcapabilities, such as System on a Chip (SoC). The logic chips can carryout specific functions by accessing the memory chips. For example, thelogic chips carry out the functions by reading and executing the programcodes or program instructions stored in the memory chips.

Reference is made back to FIG. 1 . The IC product 100 has a first side102, a second side 104, a third side 106, and a fourth side 108. Thefour sides of the IC product 100 may be the four sides of the substrate150. The IC product 100 further has a center 101. One side of the firstlogic chip 112 and the second side 104 substantially overlap (i.e., oneside of the first logic chip 112 is substantially aligned with thesecond side 104), that is, the first logic chip 112 is adjacent to thesecond side 104. Similarly, one side of the second logic chip 114 andthe third side 106 substantially overlap, one side of the third logicchip 116 and the fourth side 108 substantially overlap, and one side ofthe fourth logic chip 118 and the first side 102 substantially overlap.

Similarly, one side of the first other chip 132, one side of the secondother chip 134, one side of the third other chip 136, and one side ofthe fourth other chip 138 substantially overlap with the first side 102,the second side 104, the third side 106, and the fourth side 108,respectively.

Similarly, one side of the first memory chip 122, one side of the secondmemory chip 124, one side of the third memory chip 126, and one side ofthe fourth memory chip 128 substantially overlap with the first side102, the second side 104, the third side 106, and the fourth side 108,respectively. In addition, because the first memory chip 122, the secondmemory chip 124, the third memory chip 126, and the fourth memory chip128 are arranged at the four corners of the IC product 100, another sideof the first memory chip 122, another side of the second memory chip124, another side of the third memory chip 126, and another side of thefourth memory chip 128 substantially overlap with the second side 104,the third side 106, the fourth side 108, and the first side 102,respectively.

As shown in FIG. 1 , the first logic chip 112 is adjacent to the secondlogic chip 114 and the fourth logic chip 118, the second logic chip 114is adjacent to the first logic chip 112 and the third logic chip 116,the third logic chip 116 is adjacent to the second logic chip 114 andthe fourth logic chip 118, and the fourth logic chip 118 is adjacent tothe first logic chip 112 and the third logic chip 116. In someembodiments, the vertices of the first logic chip 112, the second logicchip 114, the third logic chip 116, and the fourth logic chip 118substantially contact each other at the center 101. However, the firstmemory chip 122, the second memory chip 124, the third memory chip 126,and the fourth memory chip 128 are not adjacent to each other, and thefirst other chip 132, the second other chip 134, the third other chip136, and the fourth other chip 138 are not adjacent to each other.

In some embodiments, the areas of the first logic chip 112, the secondlogic chip 114, the third logic chip 116, and the fourth logic chip 118are substantially identical; the areas of the first memory chip 122, thesecond memory chip 124, the third memory chip 126, and the fourth memorychip 128 are substantially identical; and the areas of the first otherchip 132, the second other chip 134, the third other chip 136, and thefourth other chip 138 are substantially identical.

In some embodiments, the first logic chip 112, the second logic chip114, the third logic chip 116, and the fourth logic chip 118 includesubstantially the same constituent components; the first memory chip122, the second memory chip 124, the third memory chip 126, and thefourth memory chip 128 include substantially the same constituentcomponents; and the first other chip 132, the second other chip 134, thethird other chip 136, and the fourth other chip 138 includesubstantially the same constituent components. The constituentcomponents include, but are not limited to, transistors, resistors,capacitors, and/or inductors. In other embodiments, the constituentcomponents of the first logic chip 112, the second logic chip 114, thethird logic chip 116, and the fourth logic chip 118 are the same interms of both type(s) and quantity; the constituent components of thefirst memory chip 122, the second memory chip 124, the third memory chip126, and the fourth memory chip 128 are the same in terms of bothtype(s) and quantity; and the constituent components of the first otherchip 132, the second other chip 134, the third other chip 136, and thefourth other chip 138 are the same in terms of both type(s) andquantity.

In some embodiments, the first other chip 132, the second other chip134, the third other chip 136, and the fourth other chip 138 areinput/output (I/O) chips that contain I/O circuits, and the first logicchip 112, the second logic chip 114, the third logic chip 116, and thefourth logic chip 118 use the I/O circuits to transmit or receivesignals. In other embodiments, the first other chip 132, the secondother chip 134, the third other chip 136, and the fourth other chip 138are silicon chips that do not contain any circuits.

Reference is made to FIG. 1 and FIG. 4 . The IC product 100 is dividedinto four quadrants by the X-axis and Y-axis that are perpendicular toeach other, and the X-axis and Y-axis intersect at the center 101. Thefirst chip group (including the first logic chip 112, the first memorychip 122, and the first other chip 132) is arranged in the firstquadrant Q1; the second chip group (including the second logic chip 114,the second memory chip 124, and the second other chip 134) is arrangedin the fourth quadrant Q4; the third chip group (including the thirdlogic chip 116, the third memory chip 126, and the third other chip 136)is arranged in the third quadrant Q3; and the fourth chip group(including the fourth logic chip 118, the fourth memory chip 128, andthe fourth other chip 138) is arranged in the second quadrant Q2. Therelative position between the first logic chip 112 and the first memorychip 122 is identical to the relative position between the second logicchip 114 (the third logic chip 116 or the fourth logic chip 118) and thesecond memory chip 124 (the third memory chip 126 or the fourth memorychip 128); the relative position between the first logic chip 112 andthe first other chip 132 is identical to the relative position betweenthe second logic chip 114 (the third logic chip 116 or the fourth logicchip 118) and the second other chip 134 (the third other chip 136 or thefourth other chip 138); the relative position between the first memorychip 122 and the first other chip 132 is identical to the relativeposition between the second memory chip 124 (the third memory chip 126or the fourth memory chip 128) and the second other chip 134 (the thirdother chip 136 or the fourth other chip 138).

If the first chip group is rotated 90 degrees clockwise on the plane PLwith respect to the center 101, the first chip group and the second chipgroup will substantially overlap (i.e., the first logic chip 112 and thesecond logic chip 114 together possess rotational symmetry, the firstmemory chip 122 and the second memory chip 124 together possessrotational symmetry, and the first other chip 132 and the second otherchip 134 together possess rotational symmetry, with the center ofrotational symmetry being the center 101 and the rotation angle being 90degrees). Similarly, if the first chip group is rotated 90 degreescounterclockwise or 270 degrees clockwise on the plane PL with respectto the center 101, the first chip group and the fourth chip group willsubstantially overlap.

If the first chip group is rotated 180 degrees on the plane PL withrespect to the center 101, the first chip group and the third chip groupwill substantially overlap. In other words, the first chip group and thethird chip group together possess point symmetry with respect to thecenter 101 (i.e., the first logic chip 112 and the third logic chip 116together possess point symmetry; the first memory chip 122 and the thirdmemory chip 126 together possess point symmetry; and the first otherchip 132 and the third other chip 136 together possess point symmetry,with the center 101 being the center of symmetry). Similarly, the secondchip group and the fourth chip group together possess point symmetrywith respect to the center 101.

In other words, in some embodiments, the first chip group, the secondchip group, the third chip group, and the fourth chip group are each aconstituent unit of the IC product 100, that is, the first logic chip112, the second logic chip 114, the third logic chip 116, and the fourthlogic chip 118 can access or be coupled to the first memory chip 122,the second memory chip 124, the third memory chip 126, and the fourthmemory chip 128, respectively, and the first logic chip 112, the secondlogic chip 114, the third logic chip 116, and the fourth logic chip 118may be coupled to the first other chip 132, the second other chip 134,the third other chip 136, and the fourth other chip 138, respectively.One of the advantages of such an arrangement is that the outward pins(i.e., the pins to the outside of the IC product 100) of the first logicchip 112 (the second logic chip 114, the third logic chip 116, or thefourth logic chip 118) can be arranged on the second side 104 (the thirdside 106, the fourth side 108, or the first side 102), while the inwardpins (e.g., the pins communicating with the first memory chip 122, thesecond memory chip 124, the third memory chip 126, the fourth memorychip 128, the first other chip 132, the second other chip 134, the thirdother chip 136, or the fourth other chip 138) can be arranged on theside that borders the memory chip or the other chip. In this way,because the chip floorplan arrangement of the IC product 100 is simple(by merely rotating the first chip group by 90 degrees, 180 degrees, and270 degrees), different areas of the IC product 100 can be manufacturedusing the same photomask, which greatly simplifies the manufacturingprocess without wasted pins.

In some embodiments, the heat-generating parts of the first logic chip112, the second logic chip 114, the third logic chip 116, and the fourthlogic chip 118 can be arranged close to the sides of the IC product 100to improve the heat dissipation performance of the IC product 100. Inaddition, because the first logic chip 112, the second logic chip 114,the third logic chip 116, and the fourth logic chip 118 are adjacent toeach other, it is easier to connect the first logic chip 112, the secondlogic chip 114, the third logic chip 116, and the fourth logic chip 118(e.g., through the interposer 140 and/or the substrate 150), makingcommunications (e.g., data exchange) and collaborative processingbetween the first logic chip 112, the second logic chip 114, the thirdlogic chip 116, and the fourth logic chip 118 easier and more feasible.

In other embodiments, the first chip group, the second chip group, thethird chip group, and the fourth chip group are square. Morespecifically, taking the first chip group in FIG. 1 as an example,W1+W2=L1+L2, where W1 is the width of the first memory chip 122 and thefirst other chip 132, W2 is the width of the first logic chip 112, L1 isthe length of the first memory chip 122, L2 is the length of the firstother chip 132, and the length of the first logic chip 112 is L1+L2.Furthermore, because the first chip group, the second chip group, thethird chip group, and the fourth chip group are all square, the ICproduct 100 is also square.

FIG. 5 is a schematic diagram of a simplified chip floorplan arrangementof an IC product according to another embodiment of the presentinvention. FIG. 5 shows a top view of the IC product 200. The IC product200 is similar to the IC product 100, except that the first memory chip122 and the first other chip 132 are interchanged, the second memorychip 124 and the second other chip 134 are interchanged, the thirdmemory chip 126 and the third other chip 136 are interchanged, and thefourth memory chip 128 and the fourth other chip 138 are interchanged.As a result, in the embodiment of FIG. 5 , the first other chip 132, thesecond other chip 134, the third other chip 136, and the fourth otherchip 138 are arranged at the four corners of the IC product 200;therefore, one side of the first other chip 132, one side of the secondother chip 134, one side of the third other chip 136, and one side ofthe fourth other chip 138 substantially overlap with the first side 102,the second side 104, the third side 106, and the fourth side 108,respectively, while another side of the first other chip 132, anotherside of the second other chip 134, another side of the third other chip136, and another side of the fourth other chip 138 substantially overlapthe second side 104, the third side 106, the fourth side 108, and thefirst side 102, respectively.

FIG. 6 is a schematic diagram of a simplified chip floorplan arrangementof an IC product according to another embodiment of the presentinvention. FIG. 6 shows a top view of the IC product 300. The IC product300 includes a first logic chip 312, a second logic chip 314, a thirdlogic chip 316, a fourth logic chip 318, a first memory chip 322, asecond memory chip 332, and a third memory chip 324, a fourth memorychip 334, a fifth memory chip 326, a sixth memory chip 336, a seventhmemory chip 328, and an eighth memory chip 338. The chip floorplanarrangement and characteristics of the IC product 300 are similar tothose of the IC product 100 and the IC product 200, except that eachchip group of the IC product 300 includes one logic chip and two memorychips but does not include any other chip.

In some embodiments, each of the first chip group (including the firstlogic chip 312, the first memory chip 322, and the second memory chip332), the second chip group (including the second logic chip 314, thethird memory chip 324, and the fourth memory chip 334), the third chipgroup (including the third logic chip 316, the fifth memory chip 326,and the sixth memory chip 336), and the fourth chip group (including thefourth logic chip 318, the seventh memory chip 328, and the eighthmemory chip 338) is a square. Taking the first chip group as an example,W1+W3=L1+L3, where W1 is the width of the first memory chip 322 and thesecond memory chip 332, W3 is the width of the first logic chip 312, L1is the length of the first memory chip 322, L3 is the length of thesecond memory chip 332, and the length of the first logic chip 312 isL1+L3. If the first chip group is rotated 90 degrees, 180 degrees, and270 degrees clockwise with respect to the center 301, the chips of thefirst chip group after the rotation will substantially overlap with therespectively corresponding chips of the second chip group, the thirdchip group, and the fourth chip group (in which case the first logicchip 312, the second logic chip 314, the third logic chip 316, and thefourth logic chip 318 correspond to each other; the first memory chip322, the third memory chip 324, the fifth memory chip 326, and theseventh memory chip 328 correspond to each other; and the second memorychip 332, the fourth memory chip 334, the sixth memory chip 336, and theeighth memory chip 338 correspond to each other). Furthermore, becausethe first chip group, the second chip group, the third chip group, andthe fourth chip group are all square, the IC product 300 is also square.

For the first chip group, the first logic chip 312 can access the firstmemory chip 322 and the second memory chip 332. Similar may be said withrespect to other chip groups, and the details shall be omitted herein.

In some embodiments, the first logic chip 312, the second logic chip314, the third logic chip 316, and the fourth logic chip 318 includesubstantially the same constituent components; the first memory chip322, the third memory chip 324, the fifth memory chip 326, and theseventh memory chip 328 include substantially the same constituentcomponents; and the second memory chip 332, the fourth memory chip 334,the sixth memory chip 336, and the eighth memory chip 338 includesubstantially the same constituent components. The constituentcomponents include, but are not limited to, transistors, resistors,capacitors, and/or inductors. In other embodiments, the constituentcomponents of the first logic chip 312, the second logic chip 314, thethird logic chip 316, and the fourth logic chip 318 are the same interms of both type(s) and quantity; the constituent components of thefirst memory chip 322, the third memory chip 324, the fifth memory chip326, and the seventh memory chip 328 are the same in terms of bothtype(s) and quantity; and the constituent components of the secondmemory chip 332, the fourth memory chip 334, the sixth memory chip 336,and the eighth memory chip 338 are the same in terms of both type(s) andquantity.

In some embodiments, the eight memory chips in FIG. 6 are totally thesame; in other words, L1=L3.

In other embodiments, the eight memory chips in FIG. 6 are the highbandwidth memory generation 3 (HBM3), and W1=L1=L3.

FIG. 7 is a schematic diagram of a simplified chip floorplan arrangementof an IC product according to another embodiment of the presentinvention. FIG. 7 shows a top view of the IC product 400. The IC product400 includes a first logic chip 412, a second logic chip 414, a thirdlogic chip 416, a fourth logic chip 418, a first memory chip 422, asecond memory chip 432, and a third memory chip 424, a fourth memorychip 434, a fifth memory chip 426, a sixth memory chip 436, a seventhmemory chip 428, an eighth memory chip 438, a first other chip 442, asecond other chip 444, a third other chip 446, and a fourth other chip448. The chip floorplan arrangement and characteristics of the ICproduct 400 are similar to those of the IC product 100 and the ICproduct 200, except that each chip group of the IC product 400 includesone logic chip, two memory chips, and one other chip.

In some embodiments, each of the first chip group (including the firstlogic chip 412, the first memory chip 422, the second memory chip 432,and the first other chip 442), the second chip group (including thesecond logic chip 414, the third memory chip 424, the fourth memory chip434, and the second other chip 444), the third chip group (including thethird logic chip 416, the fifth memory chip 426, the sixth memory chip436, and the third other chip 446), and the fourth chip group (includingthe fourth logic chip 418, the seventh memory chip 428, the eighthmemory chip 438, and the fourth other chip 448) is a square. Taking thefirst chip group as an example, W1+W4=L1+L3+L4, where W1 is the width ofthe first memory chip 422, the second memory chip 432, and the firstother chip 442, W4 is the width of the first logic chip 412, L1 is thelength of the first memory chip 422, L3 is the length of the secondmemory chip 432, L4 is the length of the first other chip 442, and thelength of the first logic chip 412 is L1+L3+L4. If the first chip groupis rotated 90 degrees, 180 degrees, and 270 degrees clockwise withrespect to the center 401, the chips of the first chip group after therotation will substantially overlap with the respectively correspondingchips of the second chip group, the third chip group, and the fourthchip group (in which case the first logic chip 412, the second logicchip 414, the third logic chip 416, and the fourth logic chip 418correspond to each other; the first memory chip 422, the third memorychip 424, the fifth memory chip 426, and the seventh memory chip 428correspond to each other; the second memory chip 432, the fourth memorychip 434, the sixth memory chip 436, and the eighth memory chip 438correspond to each other; and the first other chip 442, the second otherchip 444, the third other chip 446, and the fourth other chip 448correspond to each other). Furthermore, because the first chip group,the second chip group, the third chip group, and the fourth chip groupare all square, the IC product 400 is also square.

For the first chip group, the first logic chip 412 can access the firstmemory chip 422 and the second memory chip 432. Similar may be said withrespect to other chip groups, and the details shall be omitted herein.

In some embodiments, the first logic chip 412, the second logic chip414, the third logic chip 416, and the fourth logic chip 418 includesubstantially the same constituent components; the first memory chip422, the third memory chip 424, the fifth memory chip 426, and theseventh memory chip 428 include substantially the same constituentcomponents; the second memory chip 432, the fourth memory chip 434, thesixth memory chip 436, and the eighth memory chip 438 includesubstantially the same constituent components; and the first other chip442, the second other chip 444, the third other chip 446, and the fourthother chip 448 include substantially the same constituent components.The constituent components include, but are not limited to, transistors,resistors, capacitors, and/or inductors. In other embodiments, theconstituent components of the first logic chip 412, the second logicchip 414, the third logic chip 416, and the fourth logic chip 418 arethe same in terms of both type(s) and quantity; the constituentcomponents of the first memory chip 422, the third memory chip 424, thefifth memory chip 426, and the seventh memory chip 428 are the same interms of both type(s) and quantity; the constituent components of thesecond memory chip 432, the fourth memory chip 434, the sixth memorychip 436, and the eighth memory chip 438 are the same in terms of bothtype(s) and quantity; and the constituent components of the first otherchip 442, the second other chip 444, the third other chip 446, and thefourth other chip 448 are the same in terms of both type(s) andquantity.

In some embodiments, the eight memory chips in FIG. 7 are totally thesame; in other words, L1=L3.

In the embodiment of FIG. 7 , the second memory chip 432, the fourthmemory chip 434, the sixth memory chip 436, and the eighth memory chip438 are arranged at the four corners of the IC product 400; and thefirst memory chip 422 (the third memory chip 424, the fifth memory chip426, or the seventh memory chip 428) is arranged between the secondmemory chip 432 (the fourth memory chip 434, the sixth memory chip 436,or the eighth memory chip 438) and the first other chip 442 (the secondother chip 444, the third other chip 446, or the fourth other chip 448).

FIG. 8 is a schematic diagram of a simplified chip floorplan arrangementof an IC product according to another embodiment of the presentinvention. FIG. 8 shows a top view of the IC product 500. The IC product500 is similar to the IC product 400, except that the first other chip442, the second other chip 444, the third other chip 446, and the fourthother chip 448 are arranged at the four corners of the IC product 500,and the second memory chip 432 (the fourth memory chip 434, the sixthmemory chip 436, or the eighth memory chip 438) is arranged between thefirst memory chip 422 (the third memory chip 424, the fifth memory chip426, or the seventh memory chip 428) and the first other chip 442 (thesecond other chip 444, the third other chip 446, or the fourth otherchip 448).

FIG. 9 is a schematic diagram of a simplified chip floorplan arrangementof an IC product according to another embodiment of the presentinvention. FIG. 9 shows a top view of the IC product 600. The IC product600 is similar to the IC product 400, except that the first other chip442 (the second other chip 444, the third other chip 446, or the fourthother chip 448) is arranged between the first memory chip 422 (the thirdmemory chip 424, the fifth memory chip 426, or the seventh memory chip428) and the second memory chip 432 (the fourth memory chip 434, thesixth memory chip 436, or the eighth memory chip 438).

The memory chips in FIG. 1 and FIGS. 5 to 9 are the high bandwidthmemory generation 3 (HBM3) which is square in shape. However, theabove-mentioned memory chips can also be the high bandwidth memorygeneration 2 (HBM2), as shown in FIGS. 10 to 15 (corresponding to FIGS.1 and 5 to 9 , respectively). The first memory chip 722, the secondmemory chip 724, the third memory chip 726, and the fourth memory chip728 of the IC product 700 and the IC product 800, the first memory chip922, the second memory chip 932, the third memory chip 924, the fourthmemory chip 934, the fifth memory chip 926, the sixth memory chip 936,the seventh memory chip 928, and the eighth memory chip 938 of the ICproduct 900, the first memory chip 1022, the second memory chip 1032,the third memory chip 1024, the fourth memory chip 1034, the fifthmemory chip 1026, the sixth memory chip 1036, the seventh memory chip1028, and the eighth memory chip 1038 of the IC product 1000, the ICproduct 1100, and the IC product 1200 are the HBM2. The descriptions ofFIGS. 10 to 15 may correspond to the descriptions of FIGS. 1 and 5 to 9respectively, and the details are thus omitted for brevity.

In addition, in other embodiments, the memory chips in FIGS. 10 to 15may be the Enhanced high bandwidth memory generation 2 (Enhanced HBM2).

In summary, according to the present invention, the proposed chipfloorplan arrangement makes the most of the substrate area by tightlyarranging the chips in the IC products, making the IC products morecompetitive. Furthermore, the rotationally symmetric floorplanarrangement and/or point-symmetric floorplan arrangement of the chips inthe IC product can not only avoid waste of pins but also simplify thephotomask in complexity because different parts of the IC product can befabricated using of the same photomask.

In another aspect, the aforementioned rotationally symmetric and/orpoint-symmetric floorplan arrangement(s) of the chips on the IC productfacilitate(s) the semiconductor manufacturers to fabricate, by using thesame set of photomasks, the IC products that are nearly four times thearea of the photomask, which significantly reduces the manufacturingcost of the IC products.

It should be noted that the floorplan arrangements of the chips in theIC product mentioned above are intended to illustrate the invention byway of examples, rather than to limit the actual implementation of thepresent invention. For example, in an alternative embodiment, theaforementioned logic chips, memory chips, and/or other chips can bearranged in the four quadrants of the IC product in line symmetry withrespect to the central axis of the IC product which passes through thecenter and is perpendicular to any side.

Certain terms are used throughout the description and the claims torefer to particular components. One skilled in the art appreciates thata component may be referred to as different names. This disclosure doesnot intend to distinguish between components that differ in name but notin function. In the description and in the claims, the term “comprise”is used in an open-ended fashion, and thus should be interpreted to mean“include, but not limited to.” The term “couple” is intended toencompass any indirect or direct connection. Accordingly, if thisdisclosure mentioned that a first device is coupled with a seconddevice, it means that the first device may be directly or indirectlyconnected to the second device through electrical connections, wirelesscommunications, optical communications, or other signal connectionswith/without other intermediate devices or connection means.

The term “and/or” may comprise any and all combinations of one or moreof the associated listed items. In addition, the singular forms “a,”“an,” and “the” herein are intended to comprise the plural forms aswell, unless the context clearly indicates otherwise.

In the drawings, the size and relative sizes of some elements may beexaggerated or simplified for clarity. Accordingly, unless the contextclearly specifies, the shape, size, relative size, and relative positionof each element in the drawings are illustrated merely for clarity, andnot intended to be used to restrict the claim scope.

For the purpose of explanatory convenience in the specification,spatially relative terms, such as “on,” “above,” “below,” “beneath,”“higher,” “lower,” “upward,” “downward,” “forward,” “backward,” and thelike, may be used herein to describe the function of a particularelement or to describe the relationship of one element to anotherelement(s) as illustrated in the drawings. It will be understood thatthe spatially relative terms are intended to encompass differentorientations of the element in use, in operations, or in assembly inaddition to the orientation depicted in the drawings. For example, ifthe element in the drawings is turned over, elements described as “on”or “above” other elements would then be oriented “under” or “beneath”the other elements. Thus, the exemplary term “beneath” can encompassboth an orientation of above and beneath. For another example, if theelement in the drawings is reversed, the action described as “forward”may become “backward,” and the action described as “backward” may become“forward.” Thus, the exemplary description “forward” can encompass bothan orientation of forward and backward.

Throughout the description and claims, it will be understood that when acomponent is referred to as being “positioned on,” “positioned above,”“connected to,” “engaged with,” or “coupled with” another component, itcan be directly on, directly connected to, or directly engaged with theother component, or intervening component may be present. In contrast,when a component is referred to as being “directly on,” “directlyconnected to,” or “directly engaged with” another component, there areno intervening components present.

Other embodiments of the invention will be apparent to those skilled inthe art from consideration of the specification and practice of theinvention disclosed herein. It is intended that the specification andexamples be considered as exemplary only, with a true scope and spiritof the invention indicated by the following claims.

What is claimed is:
 1. An integrated circuit (IC) product (100; 200;300; 400; 500; 600), comprising: a first chip (112; 312; 412); a secondchip (114; 314; 414); a third chip (116; 316; 416); a fourth chip (118;318; 418); a fifth chip (122; 322; 422); a sixth chip (124; 324; 424); aseventh chip (126; 326; 426); an eighth chip (128; 328; 428); a ninthchip (132; 332; 432); a tenth chip (134; 334; 434); an eleventh chip(136; 336; 436); and a twelfth chip (138; 338; 438); wherein the firstchip (112; 312; 412), the second chip (114; 314; 414), the third chip(116; 316; 416, and the fourth chip (118; 318; 418) are respectivelyarranged in a first quadrant, a fourth quadrant, a third quadrant, and asecond quadrant of the IC product, and the first chip (112; 312; 412) isadjacent to the second chip (114; 314; 414) and the fourth chip (118;318; 418); wherein the fifth chip (122; 322; 422), the sixth chip (124;324; 424), the seventh chip (126; 326; 426), and the eighth chip (128;328; 428) are respectively arranged in the first quadrant, the fourthquadrant, the third quadrant, and the second quadrant of the IC product,and any two of the fifth chip (122; 322; 422), the sixth chip (124; 324;424), the seventh chip (126; 326; 426), and the eighth chip (128; 328;428) are not adjacent to each other; wherein the ninth chip (132; 332;432), the tenth chip (134; 334; 434), the eleventh chip (136; 336; 436),and the twelfth chip (138; 338; 438) are respectively arranged in thefirst quadrant, the fourth quadrant, the third quadrant, and the secondquadrant of the IC product, and any two of the ninth chip (132; 332;432), the tenth chip (134; 334; 434), the eleventh chip (136; 336; 436),and the twelfth chip (138; 338; 438) are not adjacent to each other;wherein the first chip (112; 312; 412), the second chip (114; 314; 414),the third chip (116; 316; 416), and the fourth chip (118; 318; 418) areadjacent to a second side (104), a third side (106), a fourth side(108), and a first side (102) of the IC product (100; 200; 300; 400;500; 600), respectively.
 2. The IC product (100; 200; 300; 400; 500;600) of claim 1, wherein the first chip (112; 312; 412), the second chip(114 314; 414), the third chip (116; 316; 416), and the fourth chip(118; 318; 418) are logic chips that are substantially the same in areaand constituent components; and the fifth chip (122; 322; 422), thesixth chip (124; 324; 424), the seventh chip (126; 326; 426), and theeighth chip (128; 328; 428) are memory chips that are substantially thesame in area and constituent components.
 3. The IC product (100; 200;300; 400; 500; 600) of claim 2, wherein the first chip (112; 312; 412),the second chip (114; 314; 414), the third chip (116; 316; 416), thefourth chip (118; 318; 418), the fifth chip (122; 322; 422), the sixthchip (124; 324; 424), the seventh chip (126; 326; 426), the eighth chip(128; 328; 428), the ninth chip (132; 332; 432), the tenth chip (134;334; 434), the eleventh chip (136; 336; 436), and the twelfth chip (138;338; 438) are substantially on the same plane; and wherein the firstchip (112; 312; 412) and the third chip (116; 316; 416) together possesspoint symmetry with respect to a center (101; 301; 401) of the ICproduct (100; 200; 300; 400; 500; 600), the second chip (114; 314; 414)and the fourth chip (118; 318; 418) together possess point symmetry withrespect to the center (101; 301; 401), the fifth chip (122; 322; 422)and the seventh chip (126; 326; 426) together possess point symmetrywith respect to the center (101; 301; 401), the sixth chip (124; 324;424) and the eighth chip (128; 328; 428) together possess point symmetrywith respect to the center (101; 301; 401), the ninth chip (132; 332;432) and the eleventh chip (136; 336; 436) together possess pointsymmetry with respect to the center (101; 301; 401), and the tenth chip(134; 334; 434) and the twelfth chip (138; 338; 438) together possesspoint symmetry with respect to the center (101; 301; 401).
 4. The ICproduct (100; 200; 300; 400; 500; 600) of claim 1, wherein the fifthchip (122; 322; 422), the sixth chip (124; 324; 424), the seventh chip(126; 326; 426), and the eighth chip (128; 328; 428) are adjacent to thefirst side (102), the second side (104), the third side (106), and thefourth side (108) of the IC product (100; 200; 300; 400; 500; 600),respectively.
 5. The IC product (100) of claim 4, wherein the fifth chip(122), the sixth chip (124), the seventh chip (126), and the eighth chip(128) are further adjacent to the second side (104), the third side(106), the fourth side (108), and the first side (102) of the IC product(100), respectively.
 6. The IC product (100; 200; 300; 400; 500; 600) ofclaim 1, wherein the ninth chip (132; 332; 432), the tenth chip (134;334; 434), the eleventh chip (136; 336; 436), and the twelfth chip (138;338; 438) are adjacent to the first side (102), the second side (104),the third side (106), and the fourth side (108) of the IC product (100;200; 300; 400; 500; 600), respectively.
 7. The IC product (200; 300;400; 600) of claim 6, wherein the ninth chip (132; 332; 432), the tenthchip (134; 334; 434), the eleventh chip (136; 336; 436), and the twelfthchip (138; 338; 438) are further adjacent to the second side (104), thethird side (106), the fourth side (108), and the first side (102) of theIC product (200; 300; 400; 600), respectively.
 8. The IC product (300;400; 500; 600) of claim 2, wherein the ninth chip (332; 432), the tenthchip (334; 434), the eleventh chip (336; 436), and the twelfth chip(338; 438) are memory chips.
 9. The IC product (400; 500; 600) of claim8, further comprising: a thirteenth chip (442); a fourteenth chip (444);a fifteenth chip (446); and a sixteenth chip (448); wherein thethirteenth chip (442), the fourteenth chip (444), the fifteenth chip(446), and the sixteenth chip (448) are arranged in the first quadrant,the fourth quadrant, the third quadrant, and the second quadrant,respectively; and the fifth chip (422), the sixth chip (424), theseventh chip (426), the eighth chip (428), the ninth chip (432), thetenth chip (434), the eleventh chip (436), the twelfth chip (438), thethirteenth chip (442), the fourteenth chip (444), the fifteenth chip(446), and the sixteenth chip (448) are the same in width (W1).
 10. TheIC product (400; 500) of claim 9, wherein the fifth chip (422) isarranged between the ninth chip (432) and the thirteenth chip (442), thesixth chip (424) is arranged between the tenth chip (434) and thefourteenth chip (444), the seventh chip (426) is arranged between theeleventh chip (436) and the fifteenth chip (446), and the eighth chip(428) is arranged between the twelfth chip (438) and the sixteenth chip(448).
 11. The IC product (400) of claim 10, wherein the ninth chip(432), the tenth chip (434), the eleventh chip (436), and the twelfthchip (438) are arranged at four corners of the IC product (400),respectively.
 12. The IC product (500) of claim 10, wherein thethirteenth chip (442), the fourteenth chip (444), the fifteenth chip(446), and the sixteenth chip (448) are arranged at four corners of theIC product (500), respectively.
 13. The IC product (600) of claim 9,wherein the thirteenth chip (442) is arranged between the fifth chip(422) and the ninth chip (432), the fourteenth chip (444) is arrangedbetween the sixth chip (424) and the tenth chip (434), the fifteenthchip (446) is arranged between the seventh chip (426) and the eleventhchip (436), and the sixteenth chip (448) is arranged between the eighthchip (428) and the twelfth chip (438).
 14. An integrated circuit (IC)product (100; 200; 300; 400; 500; 600), comprising: a first chip (112;312; 412); a second chip (114; 314; 414); a third chip (116; 316; 416);a fourth chip (118; 318; 418); a fifth chip (122; 322; 422); a sixthchip (124; 324; 424); a seventh chip (126; 326; 426); an eighth chip(128; 328; 428); a ninth chip (132; 332; 432); a tenth chip (134; 334;434); an eleventh chip (136; 336; 436); and a twelfth chip (138; 338;438); wherein the first chip (112; 312; 412), the second chip (114; 314;414), the third chip (116; 316; 416), the fourth chip (118; 318; 418),the fifth chip (122; 322; 422), the sixth chip (124; 324; 424), theseventh chip (126; 326; 426), the eighth chip (128; 328; 428), the ninthchip (132; 332; 432), the tenth chip (134; 334; 434), the eleventh chip(136; 336; 436), and the twelfth chip (138; 338; 438) are substantiallyon a plane (PL); wherein when the first chip (112; 312; 412) is rotated90 degrees on the plane with respect to a center (101; 301; 401) of theIC product (100; 200; 300; 400; 500; 600), the first chip (112; 312;412) substantially overlaps with the second chip (114; 314; 414) or thefourth chip (118; 318; 418), and when the first chip (112; 312; 412) isrotated 180 degrees on the plane with respect to the center (101; 301;401), the first chip (112; 312; 412) substantially overlaps with thethird chip (116; 316; 416); wherein when the fifth chip (122; 322; 422)is rotated 90 degrees on the plane with respect to the center (101; 301;401), the fifth chip (122; 322; 422) substantially overlaps with thesixth chip (124; 324; 424) or the eighth chip (128; 328; 428), and whenthe fifth chip (122; 322; 422) is rotated 180 degrees on the plane withrespect to the center (101; 301; 401), the fifth chip (122; 322; 422)substantially overlaps with the seventh chip (126; 326; 426); whereinwhen the ninth chip (132; 332; 432) is rotated 90 degrees on the planewith respect to the center (101; 301; 401), the ninth chip (132; 332;432) substantially overlaps with the tenth chip (134; 334; 434) or thetwelfth chip (138; 338; 438), and when the ninth chip (132; 332; 432) isrotated 180 degrees on the plane with respect to the center (101; 301;401), the ninth chip (132; 332; 432) substantially overlaps with theeleventh chip (136; 336; 436); wherein the first chip (112; 312; 412),the second chip (114; 314; 414), the third chip (116; 316; 416), and thefourth chip (118; 318; 418) are adjacent to a second side (104), a thirdside (106), a fourth side (108), and a first side (102) of the ICproduct (100; 200; 300; 400; 500; 600), respectively.
 15. The IC product(100; 200; 300; 400; 500; 600) of claim 14, wherein the first chip (112;312; 412), the second chip (114 314; 414), the third chip (116; 316;416), and the fourth chip (118; 318; 418) are logic chips that aresubstantially the same in area and constituent components; and the fifthchip (122; 322; 422), the sixth chip (124; 324; 424), the seventh chip(126; 326; 426), and the eighth chip (128; 328; 428) are memory chipsthat are substantially the same in area and constituent components. 16.The IC product (100; 200; 300; 400; 500; 600) of claim 15, wherein thefirst chip (112; 312; 412) is adjacent to the second chip (114; 314;414) and the fourth chip (118; 318; 418), and the second chip (114; 314;414) is adjacent to the first chip (112; 312; 412) and the third chip(116; 316; 416).
 17. The IC product (100; 200; 300; 400; 500; 600) ofclaim 15, wherein any two of the fifth chip (122; 322; 422), the sixthchip (124; 324; 424), the seventh chip (126; 326; 426), and the eighthchip (128; 328; 428) are not adjacent to each other, and any two of theninth chip (132; 332; 432), the tenth chip (134; 334; 434), the eleventhchip (136; 336; 436), and the twelfth chip (138; 338; 438) are notadjacent to each other.
 18. The IC product (100; 200; 300; 400; 500;600) of claim 14, wherein the fifth chip (122; 322; 422), the sixth chip(124; 324; 424), the seventh chip (126; 326; 426), and the eighth chip(128; 328; 428) are adjacent to the first side (102), the second side(104), the third side (106), and the fourth side (108) of the IC product(100; 200; 300; 400; 500; 600), respectively.
 19. The IC product (100)of claim 18, wherein the fifth chip (122), the sixth chip (124), theseventh chip (126), and the eighth chip (128) are further adjacent tothe second side (104), the third side (106), the fourth side (108), andthe first side (102) of the IC product (100), respectively.
 20. The ICproduct (100; 200; 300; 400; 500; 600) of claim 14, wherein the ninthchip (132; 332; 432), the tenth chip (134; 334; 434), the eleventh chip(136; 336; 436), and the twelfth chip (138; 338; 438) are adjacent tothe first side (102), the second side (104), the third side (106), andthe fourth side (108) of the IC product (100; 200; 300; 400; 500; 600),respectively.
 21. The IC product (200; 300; 400; 600) of claim 20,wherein the ninth chip (132; 332; 432), the tenth chip (134; 334; 434),the eleventh chip (136; 336; 436), and the twelfth chip (138; 338; 438)are further adjacent to the second side (104), the third side (106), thefourth side (108), and the first side (102) of the IC product (200; 300;400; 600), respectively.
 22. The IC product (300; 400; 500; 600) ofclaim 15, wherein the ninth chip (332; 432), the tenth chip (334; 434),the eleventh chip (336; 436), and the twelfth chip (338; 438) are memorychips.
 23. The IC product (400; 500; 600) of claim 22, furthercomprising: a thirteenth chip (442); a fourteenth chip (444); afifteenth chip (446); and a sixteenth chip (448); wherein the thirteenthchip (442), the fourteenth chip (444), the fifteenth chip (446), and thesixteenth chip (448) are substantially on the plane (PL); and the fifthchip (422), the sixth chip (424), the seventh chip (426), the eighthchip (428), the ninth chip (432), the tenth chip (434), the eleventhchip (436), the twelfth chip (438), the thirteenth chip (442), thefourteenth chip (444), the fifteenth chip (446), and the sixteenth chip(448) are the same in width (W1).
 24. The IC product (400; 500) of claim23, wherein the fifth chip (422) is arranged between the ninth chip(432) and the thirteenth chip (442), the sixth chip (424) is arrangedbetween the tenth chip (434) and the fourteenth chip (444), the seventhchip (426) is arranged between the eleventh chip (436) and the fifteenthchip (446), and the eighth chip (428) is arranged between the twelfthchip (438) and the sixteenth chip (448).
 25. The IC product (400) ofclaim 24, wherein the ninth chip (432), the tenth chip (434), theeleventh chip (436), and the twelfth chip (438) are arranged at fourcorners of the IC product (400), respectively.
 26. The IC product (500)of claim 24, wherein the thirteenth chip (442), the fourteenth chip(444), the fifteenth chip (446), and the sixteenth chip (448) arearranged at four corners of the IC product (500), respectively.
 27. TheIC product (600) of claim 23, wherein the thirteenth chip (442) isarranged between the fifth chip (422) and the ninth chip (432), thefourteenth chip (444) is arranged between the sixth chip (424) and thetenth chip (434), the fifteenth chip (446) is arranged between theseventh chip (426) and the eleventh chip (436), and the sixteenth chip(448) is arranged between the eighth chip (428) and the twelfth chip(438).